This series of products are one-component low-temperature fast-curing improved epoxy resin adhesives. It can be cured quickly at low temperature and in a short time. Forms excellent adhesion between many different types of materials. The product has excellent working performance and high storage stability. At the same time, the product can be repaired under appropriate conditions. This product is especially suitable for low temperature curing process, mainly used for bonding heat-sensitive components, suitable for memory cards, CCD/CMOS and other products, and can also be used for bonding and reinforcement of various active and passive components in PCBA assembly etc.; also suitable for backlight LED lens bonding.