It is suitable for bonding of frames, casings and camera modules of mobile phones, tablets, notebooks and wearable devices. It has high bonding strength, fast curing speed, and good durability and reliability.
Good adhesion after curing, high colloid hardness, no need to mix glue, no vacuum defoaming, high viscosity, no flow, good adhesion to metal, glass, transparent plastics such as PC, PET, ABS, PMMA, etc. . Good weather resistance. low shrinkage